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ECS-Chip

Technical University of Denmark

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ECS-Chip
Work packages
WP3: Sensor hardware development and integration

WP1: Overall Project Management

WP2: Aligning sensor hardware and software requirements matching applications

WP3: Sensor hardware development and integration

WP4: Sensor software development

WP5: Sensor testing and calibration at lab scale

WP6: Risk prediction model for integration with software

WP7: Product validation by deployment to user conditions

WP8-Dissemination-of-project-outcome

WP3: Sensor hardware development and integration

ECS-Chip

Technical University of Denmark

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Anker Engelunds Vej 1
Bygning 101A
2800 Kgs. Lyngby

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